发明名称 CLEANER AND CLEANING METHOD FOR BONDING TOOL
摘要 <p>PROBLEM TO BE SOLVED: To provide a cleaner and a cleaning method for a bonding tool which are not affected by dust. SOLUTION: This cleaning method rotates a polishing part 22 almost in linear contact with a bonding surface 11 of the bonding tool 10. The polishing part 22 cleans the bonding surface 11 by moving across a line of contact with the bonding surface 11 (as shown by the arrow).</p>
申请公布号 JP2002026077(A) 申请公布日期 2002.01.25
申请号 JP20000204019 申请日期 2000.07.05
申请人 SEIKO EPSON CORP 发明人 NISHIZAWA NAOKI
分类号 B24B21/14;B24B27/033;H01L21/60;(IPC1-7):H01L21/60 主分类号 B24B21/14
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