摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cleaner and a cleaning method for a bonding tool which are not affected by dust. SOLUTION: This cleaning method rotates a polishing part 22 almost in linear contact with a bonding surface 11 of the bonding tool 10. The polishing part 22 cleans the bonding surface 11 by moving across a line of contact with the bonding surface 11 (as shown by the arrow).</p> |