| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component provided with engaging pieces in a frame which can prevent exfoliation between the frame and sealing resin. SOLUTION: This electronic component is constituted by molding an electronic element with sealing resin (4) which element is constituted of a semiconductor chip (2) and the frame (1). In the electronic component, the engaging pieces (a) are protruded from the frame (1), and the electronic element is molded with the sealing resin (4). |
