| 摘要 |
PROBLEM TO BE SOLVED: To eliminate a problem that a bonding wire touches a part on the upper surface of an electronic component other than a connecting part because an interval can not be kept between the bonding wire and the upper surface of the electronic component to cause short circuit between adjacent electrodes on the upper surface of the electronic component, and a problem that the function of the electronic component deteriorates or the electronic component is damaged because an impact is applied directly to the electrode thereof at the time of compressing the bonding wire against the electrode of the electronic component. SOLUTION: A bonding wire 4 is extended in a substantially horizontal direction from a conductor bump 6 on an electrode 5 and bent to extend in a substantially vertical direction from a wiring conductor 3. At least an electronic component 2 and the bonding wire 4 are coated with a resin coating material 7. |
