发明名称 ELECTRONIC PART MOUNTING DEVICE, ELECTRONIC PART MOUNTING METHOD AND ELECTRONIC PART MOUNTING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an electronic parts mounting device which, when a substrate is made as being tape-like, and electronic parts are conveyed in an electronic parts mounting line, while being mounted, even if a trouble occurs, can correspond to the trouble; an electronic parts mounting method; and an electronic parts mounting substrate. SOLUTION: An electronic parts mounting line contains a solder forming part 12 and an electronic parts mounting part 13 as stagnation permitting mounting parts which permit to stop a temporal conveyance of a substrate 1, and a thermal process part 14 as stagnation non-permitting mounting parts which does not permit to stop it. When any trouble occurs in the stagnation permitting mounting parts, the substrate 1 is cut off from a border of a block by a cutter 20 of a cutting part 16, and the downstream thermal process part 14 is continued to operate. Further, the upstream solder forming part 12 and the electronic parts mounting part 13 are stopped operating, to repair the trouble.
申请公布号 JP2002026598(A) 申请公布日期 2002.01.25
申请号 JP20000209426 申请日期 2000.07.11
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HAJI HIROSHI
分类号 H05K13/04 主分类号 H05K13/04
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