| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting device and mounting method for electronic parts capable of enlarging an application scope of a concurrent transfer of a plurality of parts to enhance mounting efficiency. SOLUTION: In a mounting method for electronic parts for concurrently picking up electronic parts P1, P2 by a transfer head provided with a plurality of nozzles 6b from a supply part of electronic parts to transfer them to a substrate, a pitch difference ΔP between a nozzle pitch Pn and a part pitch Pp is weighted based on allowable offset values d1, d2 indicating a position slippage amount allowable for each electronic part and is distributed to ΔP1, ΔP2, and then the transfer head is positioned. Thus, the pitch difference can rationally be distributed based on the allowable offset value of each part, and an application scope of a concurrent transfer of a plurality of parts can be enlarged. |
