发明名称 REFLOW FURNACE AND HEATING METHOD USING IT
摘要 PROBLEM TO BE SOLVED: To provide a reflow furnace which is reduced in cost by simplifying its structure and can more uniformly heat an object to be heated in the heating-up section of the object and can keep the temperature of the object constant in the temperature-keeping section of the object. SOLUTION: This reflow furnace is provided with a first heat insulating structure section 12 which thermally insulates an object preheating zone PH in which the object 8 to be heated is preheated from the outside, a first air heating heater 50 which heats the object 8 in the section 12 with hot air, and first infrared heaters 60A and 60B which heat the object 8 in the section 12. The furnace is also provided with a first air circulating section 40 which circulates the air in the section 12, a second heat insulating structure section 14 which thermally insulates a properly object heating zone RF in which the preheated object 8 is properly heated and is integrated with the first heat insulating structure section 12, and a second air heating heater 150 which heats the object 8 in the section 14 with hot air. In addition, the furnace is also provided with second infrared heaters 160A and 160B which heat the object 8 in the section 14 and a second air circulating section 140 which circulates the air in the section 14.
申请公布号 JP2002026508(A) 申请公布日期 2002.01.25
申请号 JP20000208252 申请日期 2000.07.05
申请人 SONY CORP 发明人 MURATA YOSHITAKA
分类号 B23K1/00;B23K1/005;B23K1/008;B23K3/04;B23K101/42;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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