| 摘要 |
PROBLEM TO BE SOLVED: To provide a radiating spacer which effectively dissipates heat generated from a semiconductor element and is excellent in electromagnetic wave absorbing characteristic. SOLUTION: This radiating spacer composed of silicone cured material which is filled with heat conducting filler of 40-80 vol.%. The heat conducting filler contains conductive powder whose volume resistivity is at most 5×10-6Ω.m and magnesium and/or calcium borate powder which is covered with hexagonal boron nitride. |
