| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a multilayer printed wiring board that can inhibit misalignment caused by press and heating in the lamination process of an interlayer-insulating layer on the multilayer printed-wiring board, can put the accuracy of laser machining to practical use, and can achieve higher-density wiring. SOLUTION: An uncured resin sheet is laminated on both the surfaces of the printed- wiring board of at least one layer, and an organic cover film having a mold release property on the surface of the uncured resin sheet is laminated at the upper and lower parts of an inner-layer printed-wiring board. A laser beam is applied from the surface of the organic cover film to a desired position, and a non-through hole is formed. In this case, the non-through hole reaches a metal land for interlayer continuity formed on the internal layer printed-wiring board. The non-through hole is filled with thermosetting conductive paste for setting to a semi-cured state, and the organic cover film is released. After that, a process is repeated, thus obtaining the multiplayer printed- wiring board. In the process, metal foil is laminated onto both the sides of a resin sheet, the resin sheet is completely cured by press and heating, the metal foil is machined, and a circuit pattern is formed on both the sides. |
