发明名称 SURFACE ACOUSTIC WAVE ELEMENT
摘要 PROBLEM TO BE SOLVED: To solve a problem of a conventional surface acoustic wave element that has had a limit of combinations of substrates because a thermal stress exerted on a layered substrate may cause a defect onto the layered substrate depending on a temperature at heat treatment for the purpose of laminating a propagation substrate and an auxiliary substrate through direct bonding. SOLUTION: The surface acoustic wave element of this invention is provided with a propagation substrate 11 made of a piezoelectric substrate, an auxiliary substrate 12 layered on the propagation substrate via an adhesive layer 14, and interdigital electrodes 13 that stimulate a surface acoustic wave and is formed on a side of the propagation substrate 11 opposite to the adhesive side. Selecting a glass transition point Tg of the cured adhesive 14 for -30 deg.C or over can obtain the surface acoustic wave element with an excellent temperature characteristic and a high degree of design freedom of the temperature characteristic without changing various characteristics of the piezoelectric substrate such as an electromechanical coupling coefficient.
申请公布号 JP2002026684(A) 申请公布日期 2002.01.25
申请号 JP20000201874 申请日期 2000.07.04
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SATOU HIROTERU;ONISHI KEIJI
分类号 H03H9/145;(IPC1-7):H03H9/145 主分类号 H03H9/145
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