发明名称 |
SURFACE ACOUSTIC WAVE ELEMENT |
摘要 |
PROBLEM TO BE SOLVED: To solve a problem of a conventional surface acoustic wave element that has had a limit of combinations of substrates because a thermal stress exerted on a layered substrate may cause a defect onto the layered substrate depending on a temperature at heat treatment for the purpose of laminating a propagation substrate and an auxiliary substrate through direct bonding. SOLUTION: The surface acoustic wave element of this invention is provided with a propagation substrate 11 made of a piezoelectric substrate, an auxiliary substrate 12 layered on the propagation substrate via an adhesive layer 14, and interdigital electrodes 13 that stimulate a surface acoustic wave and is formed on a side of the propagation substrate 11 opposite to the adhesive side. Selecting a glass transition point Tg of the cured adhesive 14 for -30 deg.C or over can obtain the surface acoustic wave element with an excellent temperature characteristic and a high degree of design freedom of the temperature characteristic without changing various characteristics of the piezoelectric substrate such as an electromechanical coupling coefficient.
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申请公布号 |
JP2002026684(A) |
申请公布日期 |
2002.01.25 |
申请号 |
JP20000201874 |
申请日期 |
2000.07.04 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SATOU HIROTERU;ONISHI KEIJI |
分类号 |
H03H9/145;(IPC1-7):H03H9/145 |
主分类号 |
H03H9/145 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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