COPPER FOIL CIRCUIT WITH CARRIER FOIL, METHOD OF MANUFACTURING PRINTED WIRING BOARD, USING THE SAME, AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a printed wiring board material and its manufacturing method which greatly reduces the manufacturing cost of the printed wiring board to supply more-low-cost printed wiring boards. SOLUTION: The copper foil circuit with a carrier foil has an organic bond interface between the carrier foil and a copper foil circuit layer. Using the copper foil circuit with the copper foil and prepregs constituting a resin base, a hot press process is applied with the prepreg contacting the surface at the copper foil circuit side, thereby manufacturing a copper lined laminate board. The carrier foil located on an outer layer of the laminate board is peeled off to manufacture a printed wiring board.