| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, in which microchips or cracks are not produced on the periphery of a cut resin, in the vicinity of the forward end of an outer lead and the outer lead is exposed on the bottom face of a resin-sealed body. SOLUTION: A semiconductor device, where the gap between outer leads exposed to the bottom face of a resin-sealed body is not filled with sealing resin, is obtained by providing a lead frame in advance with a pushback material between the leads and push and drop down the push-back material after molding. |
