| 摘要 |
PROBLEM TO BE SOLVED: To package electronic components with high density, to form a fine circuit, to improve a yield, and at the same time to reduce manufacturing costs. SOLUTION: A non-through hole 23 is formed in resin 22 of a copper-clad plate 20A by a laser beam, and is filled with conductive paste 25. A pair of upper and lower copper-clad plates 20A and 20B is heated and crimped to an internal layer plate 8, thus electrically connecting an external layer circuit 26 to an internal layer circuit 7 via the conductive paste 25. |
