| 摘要 |
PROBLEM TO BE SOLVED: To overcome a problem such that a bridge is to be supported by using an adhesive tape since the bridge connecting semiconductor chips is formed in an island shape in a semiconductor device where a plurality of semiconductor chips are mounted and are made into one package by using a conventional lead frame. SOLUTION: Die pads 50 and 51, outer connection electrodes 52, the bridges 53 and the like are half-etched and insulating resin is applied to them. Thus, one package is realized without adopting a connection member such as a support lead and the adhesive tape. Then, it can be manufactured without adopting a support substrate. Consequently, the thin semiconductor device superior in heat radiation property is obtained. |
