| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method for a semiconductor element which can joins electrodes of the semiconductor element and the circuit of a circuit board together with high reliability. SOLUTION: This method has a stage for forming through holes at the places of the circuit board 4 where the circuit of the circuit board 4 and the electrodes of the semiconductor element 1 are connected together, a stage for forming external electrode terminals by filling the through holes with conductive paste 7, a stage for forming projection bumps 3 on the electrodes 2 of the semiconductor element 1, a stage for positioning the external electrodes and the projection bumps 3, and a stage for electrically connect the electrodes 2 of the semiconductor element 1 and external electrode terminals other than the mentioned electrode terminals of the circuit board 4 by pressing the semiconductor element 1 and thus burying the projection bumps 3 in the conductive paste 7 in the through holes. |
