| 摘要 |
PROBLEM TO BE SOLVED: To provide semiconductor light-emitting equipment that emits light in desired color with high luminance. SOLUTION: This semiconductor light-emitting equipment is equipped with leads 2 and 4, a semiconductor light-emitting device 5 that is electrically connected between the leads 2 and 4, a resin sealing body 7 that seals one end of the leads 2 and 4 and the semiconductor light-emitting device 5, and a transmissive fluorescent cover 9 that has an opening 9c at one end and at the same time is deposited to the resin sealing body 7. By the fluorescent cover 9, light with wavelength being different from light that is generated from the semiconductor light-emitting device 5 on the market is taken out. The fluorescent cover 9 is formed by injection molding resin containing a phosphor, has an internal surface having the same shape as the resin sealing body 7, and is pressed onto the external surface of the resin sealing body 7, thus preventing the fluorescent cover 9 from easily departing. |
