| 发明名称 |
MOUNTING STRUCTURE AND MANUFACTURING METHOD OF THE SAME |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure with excellent adhesive strength and humidity resistance reliability. SOLUTION: The mounting structure is constructed by using an adhesiver containing denaturated resin as a conductive adhesion agent 5 which is electrically connected to electric structures 1, 3.
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| 申请公布号 |
JP2002025339(A) |
申请公布日期 |
2002.01.25 |
| 申请号 |
JP20000200870 |
申请日期 |
2000.07.03 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
TAKEZAWA HIROTERU;ISHIMARU YUKIHIRO;KITAE TAKASHI;MITANI TSUTOMU |
| 分类号 |
C09J9/02;C09J11/08;H01B1/22;H05K3/32;(IPC1-7):H01B1/22 |
主分类号 |
C09J9/02 |
| 代理机构 |
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