| 摘要 |
PROBLEM TO BE SOLVED: To provide a new method by which the degree of consumption of consumables and the thickness of a deposited film can be predicted without opening a treatment chamber. SOLUTION: In this method which is used for predicting the degree of consumption of consumables used for a plasma treatment device 10 which performs prescribed treatment on a wafer W, by using a plasma generated from a process gas by impressing high-frequency electric power upon the gas and the thickness of a deposited film, the thickness of a focus ring 20 and the voltage and current of a high-frequency power source 19, which change in accordance with the thickness of the deposited film, at the fundamental wave and an integer-multiple wave are measured with time and the thicknesses of the ring 20 and deposited film are predicted by performing multiple regression analysis by using the measurement data.
|
