| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which reduces the burden of a manufacturing process and whose production costs can be reduced by dealing with an increase in a rated current without increasing a wire bonding process. SOLUTION: A semiconductor chip 13 which comprises an IGBT or the like is mounted on the surface of a mounting board 11 via a metal pattern 12-2. The main surface of the semiconductor chip 13 and a metal pattern 12-3 are connected by a bonding wire 14. A collector external output terminal 15-1 and an emitter external output terminal 15-2 are installed on the metal patterns 12-2, 12-3. The terminal 15-1 and the terminal 15-2 are electrically connected by a welding connection to the terminal 15-1 and the terminal 15-2 by a collector lead frame 18-1 and an emitter lead frame 18-2. |
