| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board having a directly cooling structure allowing the backside of a ceramic board to directly contact a refrigerant, without inserting an intermediate such as radiating metal plate, heat sink, etc., between both. SOLUTION: The circuit board has a ceramic board (3) having a circuit (2) on the surface. The backside of the board (3) is housed (4) so as to directly contact fluidly the refrigerant. The circuit (2) is formed on at least one surface of a honeycomb-shaped ceramic board (5). |
