| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a laminated wiring board and its manufacturing method that can package electronic components without forming any lands for packaging the electronic components when the electronic components are packaged onto the side of the laminated wiring board. SOLUTION: On a laminated green sheet, a via hole that is filled with conductive paste is formed inside. In each part between the green sheets, the conductive paste for internal layer wiring and that for surface layer wiring are patterned. The green sheet is cut at the end part of the laminated green sheet, and the conductive paste for internal layer wiring is exposed for burning the green sheet. Plating layers 31 and 32 are formed in exposed internal layer wiring 22 and surface layer wiring 23 for electrically connecting the plating layers 31 and 32 to electronic components 6, 8 and 60.</p> |
