| 摘要 |
PROBLEM TO BE SOLVED: To provide a small semiconductor device which is manufactured easily by laminating semiconductor chips to be multilayered and whose insulating property is good, by a method wherein bumps are inserted into through holes in the semiconductor chips so as to be pressurized and bonded to electrodes to form an electrically conductive state, the semiconductor chips and thermoplastic films are inserted into hollow blocks, the hollow blocks are heated and the thermoplastic films are melted and bonded, to provide its manufacturing method and to provide an electronic apparatus which uses it. SOLUTION: In the semiconductor device, a plurality of semiconductor chips are laminated to be multilayered. The through holes are made in the semiconductor chips, are ball bumps are inserted into the through holes. The bumps are pressurized or thermally pressurized. The bumps are bonded to the electrodes, and the respective semiconductor chips are constituted so as to be electrically connected. |
