| 摘要 |
The invention relates to a method for producing a portable electronic device having an integrated circuit, characterized in that the inventive method includes a step which consists in directly pulverizing a protective material onto a dielectric support film (15) bearing a plurality of chips (10) that are glued and connected to connection areas (18) by wire cabling in order to create a protective film (51) on each chip (10) and the connection wires (17) thereof. The inventive method enables the thickness and shape of the protection (51) to be controlled despite high-speed operation. |
