发明名称 THERMAL INJECTION AND PROPORTIONING HEAD, METHOD FOR MAKING SAME AND FUNCTIONALISING OR ADDRESSING SYSTEM COMPRISING SAME
摘要 <p>The invention concerns an injecting and proportioning head, with at least a thermal injection and proportioning device to supply a specific amount of liquid, comprising: a recessed planar substrate (21) forming a liquid reservoir and covered, sequentially, with a non-stressed dielectric insulating membrane (22, 23) with high thermal resistance, then an etched semiconductor layer forming a heating resistor (25); said membrane and said semiconductor layer being traversed by an orifice (24) in fluid communication with the reservoir; a photolithographic resin layer in the form of a nozzle (27) on said membrane, the channel (28) of said nozzle being located in the extension of said orifice and the volume of said channel enabling to control the specific amount of liquid to be supplied. The invention also concerns a method for making said head. The method further comprises a functionalising or addressing system in particular for chemical and biological microreactors comprising such a head.</p>
申请公布号 WO2002005946(A1) 申请公布日期 2002.01.24
申请号 FR2001002274 申请日期 2001.07.12
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