HALOGEN-FREE FLAME-RETARDANT EPOXY RESIN COMPOISITION, HALOGEN-FREE FLAME-RETARDANT EPOXY RESIN COMPOSITION FOR BUILD-UP TYPE MULTILAYER BOARDS, PREPREGS, COPPER-CLAD LAMINATES, PRINTED WIRING BOARDS, RESIN FILMS WITH COPPER FOIL OR CARRIERS, AND BUILD-UP TYPE LAMINATES AND MULTILAYER BOARDS

摘要

A halogen-free flame-retardant epoxy resin composition which comprises as the essential components (A) at least one crosslinked phenoxyphosphazene compound, (B) at least one polyepoxide compound such as bisphenol A type epoxy resin, (C) a curing agent for epoxy resins, e.g., bisphenol A type novolak resin, and (D) a curing accelerator for epoxy resins, and contains 0 to 50 wt.% of an inorganic filler.