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发明名称
Verfahren zur direkten galvanischen Durchkontaktierung von zweilagigen Leiterplatten und Multilayern
摘要
申请公布号
DE59509934(D1)
申请公布日期
2002.01.24
申请号
DE19955009934
申请日期
1995.09.29
申请人
BAYER AG
发明人
WOLF, DR.;JONAS, DR.;SCHOMAECKER, DR.
分类号
C25D5/54;H05K3/42;(IPC1-7):H05K3/42
主分类号
C25D5/54
代理机构
代理人
主权项
地址
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