发明名称 |
Rechnergesteuerte Vorrichtung zum Polieren einer Oberfläche eines dünnen Materialwafers |
摘要 |
<p>A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.</p> |
申请公布号 |
DE4345407(C2) |
申请公布日期 |
2002.01.24 |
申请号 |
DE19934345407 |
申请日期 |
1993.06.10 |
申请人 |
SPEEDFAM-IPEC CORP.(N.D.GES.D.STAATES DELAWARE), CHANDLER |
发明人 |
KARLSRUD, CHRIS E.;WOERKOM, ANTHONY G. VAN;ODAGIRI, SHIGERU;NAGAHASHI, ISAO |
分类号 |
B24B37/08;B24B37/34;B24B49/16;B24B51/00;G05B19/418;H01L21/304;H01L21/677;H01L21/683;(IPC1-7):H01L21/302;B24B37/04 |
主分类号 |
B24B37/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|