| 摘要 |
A method of manufacturing a semiconductor device having a trench isolation structure includes patterning a mask film on a semiconductor substrate, forming a trench by etching the semiconductor substrate by use of the mask film, filling the trench with an insulating film by repeating depositing the insulating film in the trench and etching the insulating film by sputter etching, removing the mask film, and removing the insulating film by etching a predetermined amount of the insulating film filled in the trench. According to the sputter etching in the step of filling the trench with the insulating film, an edge between a surface of the substrate and an inner wall surface of the trench forms an inclined surface to the surface of the substrate.
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