| 发明名称 |
Process for producing semiconductor article |
| 摘要 |
<p>A process for producing a semiconductor article is provided which comprises the steps of bonding a film onto a substrate having a porous semiconductor layer, and separating the film from the substrate at the porous semiconductor layer by applying a force to the film in a peeling direction. <IMAGE> <IMAGE> <IMAGE> <IMAGE></p> |
| 申请公布号 |
AU743331(B2) |
申请公布日期 |
2002.01.24 |
| 申请号 |
AU19970048462 |
申请日期 |
1997.12.18 |
| 申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
KIYOFUMI SAKAGUCHI;TAKAO YONEHARA;SHOJI NISHIDA;KENJI YAMAGATA |
| 分类号 |
B28D5/00;G02F1/1362;H01L21/18;H01L21/20;H01L21/304;H01L21/66;H01L31/068;H01L31/18;(IPC1-7):H01L21/301 |
主分类号 |
B28D5/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
