发明名称 SOLDER BALL AND ITS PRODUCTION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a solder ball having a smooth surface shape while combining high sphericity and dimensional precision required for a solder ball and to provide its production method. SOLUTION: As to this solder ball, in the case observing the cross-section including the center of the sphere, the area ratio of dendrite in the largest one piece is <=80%.
申请公布号 JP2002020807(A) 申请公布日期 2002.01.23
申请号 JP20000200599 申请日期 2000.07.03
申请人 HITACHI METALS LTD 发明人 KUBOI TAKESHI;SATO KOJI
分类号 B23K35/26;B22F1/00;B22F9/08;B23K35/40;C22C13/00;C22C13/02;(IPC1-7):B22F9/08 主分类号 B23K35/26
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