发明名称 Heat sinks for electrical or other apparatus
摘要 A heat sink 5, e.g. for electrical components, has vanes 3 located on a base 2 wherein at least one end 6 of the fins 3 is profiled relative to the base 2. The profiled end(s) of the plates 3 may be rectilinear or curved, and the degree of profiling may be the same or different at each end.
申请公布号 GB0129040(D0) 申请公布日期 2002.01.23
申请号 GB20010029040 申请日期 2001.12.05
申请人 SEMIKRON LIMITED 发明人
分类号 H01L23/367 主分类号 H01L23/367
代理机构 代理人
主权项
地址
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