发明名称 |
ADHESIVE POLYMER COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive polymer composition excellent in molding processability and antiblocking properties and further heat resistance of adhesion and adhesive strength to a substrate. SOLUTION: This adhesive polymer composition comprises the following components (A) and (B). (A) 90-10 wt.% of a modified ethylene-α-olefin copolymer obtained by subjecting an ethylene-α-olefin copolymer having 0.870-0.930 g/cm3 density and an unsaturated carboxylic acid or its derivative to grafting reactional conditions and (B) 10-90 wt.% of a modified ethylene homopolymer or a modified ethylene-α-olefin copolymer prepared by subjecting 40-80 wt.% of an ethylene copolymer or an ethylene-α-olefin copolymer and 60-20 wt.% of an aromatic vinyl compound to grafting reactional conditions.
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申请公布号 |
JP2002020712(A) |
申请公布日期 |
2002.01.23 |
申请号 |
JP20000210720 |
申请日期 |
2000.07.12 |
申请人 |
MITSUBISHI CHEMICALS CORP |
发明人 |
IKEDA MUTSUKO;NAKAYAMA HIROYUKI;YADA YOSHINOBU |
分类号 |
C08L51/06;C09J151/06;(IPC1-7):C09J151/06 |
主分类号 |
C08L51/06 |
代理机构 |
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代理人 |
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地址 |
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