发明名称 ELECTROCONDUCTIVE RESIN MOLDED BODY
摘要 PROBLEM TO BE SOLVED: To provide an electroconductive resin molded body having good electromagnetic wave-shielding properties by improving workability, moldability and surface appearance of the molded body in obtaining the electroconductive resin molded body. SOLUTION: This electroconductive resin molded body is obtained by blending carbon fiber in a specific amount to obtain a carbon fiber reinforced thermoplastic resin molded body which is painted and coated with an electroconductive paint in 1-15μm thickness.
申请公布号 JP2002020515(A) 申请公布日期 2002.01.23
申请号 JP20000212056 申请日期 2000.07.12
申请人 TORAY IND INC 发明人 SAKAI HIDETOSHI;OKITA SHIGERU
分类号 C08J7/04;C08J5/04;C08K7/06;C08L101/00;C09D5/24;C09D201/00;H01B1/24;H05K9/00;(IPC1-7):C08J7/04 主分类号 C08J7/04
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