发明名称 POTTING AGENT FOR A HOLLOW FIBER MEMBRANE MODULE, HOLLOW FIBER MEMBRANE MODULE AND USES OF SAID HOLLOW FIBER MEMBRANE MODULE
摘要 <p>The present invention relates to a hollow fiber membrane module and its potting material used for chemical deaeration in a semiconductor production process, printers, liquid crystal sealing process or chemical production process and so forth, and to a chemical deaeration method using said hollow fiber membrane module. The hollow fiber membrane module 1 of the present invention is characterized by potting material 2 being an epoxy resin cured product in which the weight change per unit surface area of a potting material test piece after immersing said test piece in a chemical for 6 months at room temperature is within the range of -20 to +20 mg/cm&lt;2&gt;, and housing 4 being a polyolefin in which the weight change per unit surface area of a test piece after immersing said test piece in a chemical for 6 months at room temperature is within the range of -20 to +20 mg/cm&lt;2&gt;, and the total metal content is 300 ppm or less, said module being able to be used for chemical treatment for a long period of time without the occurrence of leakage from the module. &lt;IMAGE&gt;</p>
申请公布号 EP1174175(A1) 申请公布日期 2002.01.23
申请号 EP20000913079 申请日期 2000.04.03
申请人 MITSUBISHI RAYON CO., LTD. 发明人 TAKEDA, SATOSHI;KATO, OSAMI;WATARI, KENJI;NIIKAWA, KENJI;UENISHI, MASAMOTO;TASAKA, HIROSHI
分类号 B01D19/00;B01D63/02;B01D65/00;B01D69/02;B01D69/08;B01D69/12;B01D71/24;B01D71/26;B01D71/28;B01D71/34;B01D71/44;B01D71/80;C09J163/00;(IPC1-7):B01D63/00 主分类号 B01D19/00
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