发明名称 |
POTTING AGENT FOR A HOLLOW FIBER MEMBRANE MODULE, HOLLOW FIBER MEMBRANE MODULE AND USES OF SAID HOLLOW FIBER MEMBRANE MODULE |
摘要 |
<p>The present invention relates to a hollow fiber membrane module and its potting material used for chemical deaeration in a semiconductor production process, printers, liquid crystal sealing process or chemical production process and so forth, and to a chemical deaeration method using said hollow fiber membrane module. The hollow fiber membrane module 1 of the present invention is characterized by potting material 2 being an epoxy resin cured product in which the weight change per unit surface area of a potting material test piece after immersing said test piece in a chemical for 6 months at room temperature is within the range of -20 to +20 mg/cm<2>, and housing 4 being a polyolefin in which the weight change per unit surface area of a test piece after immersing said test piece in a chemical for 6 months at room temperature is within the range of -20 to +20 mg/cm<2>, and the total metal content is 300 ppm or less, said module being able to be used for chemical treatment for a long period of time without the occurrence of leakage from the module. <IMAGE></p> |
申请公布号 |
EP1174175(A1) |
申请公布日期 |
2002.01.23 |
申请号 |
EP20000913079 |
申请日期 |
2000.04.03 |
申请人 |
MITSUBISHI RAYON CO., LTD. |
发明人 |
TAKEDA, SATOSHI;KATO, OSAMI;WATARI, KENJI;NIIKAWA, KENJI;UENISHI, MASAMOTO;TASAKA, HIROSHI |
分类号 |
B01D19/00;B01D63/02;B01D65/00;B01D69/02;B01D69/08;B01D69/12;B01D71/24;B01D71/26;B01D71/28;B01D71/34;B01D71/44;B01D71/80;C09J163/00;(IPC1-7):B01D63/00 |
主分类号 |
B01D19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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