发明名称 SUPPOSITORY PACKAGE AND MULTILAYERED SHEET THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a multilayered sheet and a package which are excellent in heat resistance and moldability wherein they do not attach to a hot plate or the like when molding and sealing and which are excellent in machinability. SOLUTION: The multilayered sheet comprises a mixture of a coplymer polyester resin (PET-G) with cyclohexanedimethanol substituted for 10 to 40 mol% of ethylene glycol components of a polyethylene terephthalate and a polybutylene terephthalate(PBT), and is used as a laminate base for the suppository package.
申请公布号 JP2002019824(A) 申请公布日期 2002.01.23
申请号 JP20000210996 申请日期 2000.07.12
申请人 SUMITOMO BAKELITE CO LTD 发明人 KAWACHI YUJI
分类号 B65D75/26;A61J3/08;B32B27/36;B65D65/40;C08J5/18;C08L67/02;(IPC1-7):B65D65/40 主分类号 B65D75/26
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