发明名称 THIN FILM DEPOSITION APPARATUS
摘要 PROBLEM TO BE SOLVED: To reduce damage to the surface of an active layer and simultaneously to improve the uniformity as an insulation film apparatus for a thin film transistor(TFT). SOLUTION: In this remote plasma CVD apparatus using a line-shaped high density plasma generating part, the main part is composed of a high density plasma generating part, a film deposition gaseous starting material feeding part directly on a substrate, an exhaust port adjacent thereto and a substrate supporting stand. Further, by plurally arranging the high density plasma parts, different thin films are continuously deposited.
申请公布号 JP2002020872(A) 申请公布日期 2002.01.23
申请号 JP20000240427 申请日期 2000.07.03
申请人 CRYSTAGE CO LTD;GENTA KAGI KOGYO KOFUN YUGENKOSHI 发明人 ITO MASATAKA
分类号 C23C16/455;C23C16/507;H01L21/31;H01L21/316;(IPC1-7):C23C16/455 主分类号 C23C16/455
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