| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for plating a long substrate in which the consistent quality can be obtained at a low cost and the yield can be improved. SOLUTION: The long substrate 10 is held between carrying rolls 101 with the width direction thereof facing in the vertical direction, and carried in the longitudinal direction. A plurality of power supply terminals 50 are provided at predetermined intervals in the vicinity of one side of the long substrate 10. The power supply terminals 50 are electrically connected to a plating area of a conductor layer of a predetermined pattern formed on the longitudinal substrate 10. A plating tank 100 is provided so as to surround the periphery of the carrying rolls 101. A power supply chuck supporting cable 104 stretched between pulleys 102 and 103 and a plurality of power supply chucks 120 are provided above the plating tank 100. A plurality of power supply chucks 120 are successively brought into contact with the power supply terminals 50 of the long substrate 10 to be carried, and hold them, and the power is supplied to the power supply terminals 50 from a rotary distribution board 110 via the power supply chucks 120.
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