发明名称 |
Method of manufacturing a plastic object |
摘要 |
<p>The method involves placing a prefabricated electronic module (1) containing a semiconductor chip (5) or other electronic component, in a die cavity (2) formed from two die halves (3,4) within a half-space (12) that is formed from at least one rib protruding from the first die half. Plastics is then inserted into the die cavity.</p> |
申请公布号 |
EP1174822(A1) |
申请公布日期 |
2002.01.23 |
申请号 |
EP20000810655 |
申请日期 |
2000.07.21 |
申请人 |
SEMPAC SA |
发明人 |
TRUCKENBROD, WILLI;BAUER, WILLY AUGUST |
分类号 |
G06K19/077;(IPC1-7):G06K19/077 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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