SEMICONDUCTOR PRESSURE SENSOR

摘要

PROBLEM TO BE SOLVED: To provide a small semiconductor pressure sensor requiring non external circuits and generating no noises in the range of unnecessary pressures. SOLUTION: The semiconductor pressure sensor 1000 is formed by pasting together the frame parts and the pressure-sensitive resistance parts of a pressure switch side substrate 1001 having pressure switches previously formed, and a bridge circuit side substrate 1002 having mesa bridge circuits formed. The pressure switch side substrate 1001 can be easily formed from an SOI(Silicon On Insulator) substrate. A switch conducting silicon part 122 forms a double lever structure where a switch pressure sensitive insulating part 132 serves as a force point, switch leg part insulating layers 112A and 112B serve as fulcrums and switch contact conducting parts 14A and 14B serves as points of application. Two pressure-sensitive resistance 162 and 164 having their longitudinal direction in <1-10> direction and two other pressure-sensitive resistance 161 and 163 having their longitudinal direction in <001> direction are formed on the bridge circuit side substrate 1002 thereby the pressure sensor can be formed.