| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor which relates to a semiconductor package for mounting an area, gives little warp in a soldering process at a room temperature, is excellent in reliability on soldering resistance or temperature-cycling resistance, and has excellent moldability. SOLUTION: The epoxy resin composition for sealing a semiconductor comprises (A) a trifunctional epoxy resin and a biphenyl epoxy resin, (B) a modified novolac resin prepared by the copolycondensation ofα-naphthol and a phenol with the intervention of an aldehyde in the presence of an acid catalyst, (C) a curing promoter, and (D) a melted silica powder, wherein the composition contains all these components at 65-90% by weight; has a melt viscosity of 2-10 Pa.sec at the molding temperature; provides a cured product with a size deformation rate of 0.30% or less; and has a glass transition temperature of 140 deg.C or more.
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