发明名称 RADIATION SENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a radiation sensitive composition excellent in resolution, focal depth, dimensional controllability and heat resistance, excellent in dimple resistance particularly in the formation of a hole pattern using a halftone mask and having a wide focus margin. SOLUTION: The radiation sensitive resin composition contains an alkali- insoluble or slightly alkali-soluble resin component (A) which is made alkali- soluble by the action of an acid and a compound (B) which generates the acid under light or electron beams. The component (A) contains at least one polymerization unit of formula [1] or [4] and resins contained in the component (A) contain all of polymerization units [1], [2], [3] and [4] in totality.
申请公布号 JP2002023369(A) 申请公布日期 2002.01.23
申请号 JP20000192072 申请日期 2000.06.27
申请人 SHIPLEY CO LLC 发明人 TARUYA SHINJI;KAMEYAMA YASUHIRO
分类号 G03F7/039;C08F212/14;C08K5/00;C08K5/053;C08L25/18;G03F7/004 主分类号 G03F7/039
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