发明名称 COMPOSITION WITH HIGH-HEAT CONDUCTIVITY AND ITS USE
摘要 PROBLEM TO BE SOLVED: To provide a composition with a high-heat conductivity which is fluidized at a predetermined temperature and has an excellent heat radiating property and low heat resistance, and provide a heat radiating member capable of microscopically tightly bonding at the interface with a heat generating electronic part and a heat radiating fin, respectively. SOLUTION: The composition with a high heat conductivity is produced by mixing wax and/or paraffin having a melting point of 40-100 deg.C, a thermoplastic resin that is softened at 40-100 deg.C, a powder of an aluminum nitride sintered body and a resin composition with a good heat conductivity having an average particle size of not more than 10 ×m. The composition with a high heat conductivity is integrated with a net-like structure to produce a heat radiating member of a heat generating electronic part and produce a structure of a hat generating electronic part integral with a heat radiating fin formed by bonding through the heat radiating member.
申请公布号 JP2002020625(A) 申请公布日期 2002.01.23
申请号 JP20000209550 申请日期 2000.07.11
申请人 DENKI KAGAKU KOGYO KK 发明人 SATO MIKITOSHI;KAWANO MASATO;KAWASAKI TAKU
分类号 C08J5/00;C08K3/00;C08K3/28;C08L91/06;C08L101/12;C09K5/08;H01L23/36;H05K7/20 主分类号 C08J5/00
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