| 发明名称 |
Surface mount to-220 package and process for the manufacture thereof |
| 摘要 |
A surface mount TO-220 package includes leads which are bent within the molded housing and formed prior to molding the housing around the lead frame. A single gauge of frame material is used for both the leads and the main pad area. The bends reduce the height of the package and reduce mechanical stresses in the molded housing. |
| 申请公布号 |
GB2317989(B) |
申请公布日期 |
2002.01.23 |
| 申请号 |
GB19970020858 |
申请日期 |
1997.10.01 |
| 申请人 |
* INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
HISAO * UDAGAWA;HIROSHI * KOTANI |
| 分类号 |
H01L23/28;H01L23/31;H01L23/48;H01L23/495 |
主分类号 |
H01L23/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
