发明名称 OPTICAL WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To improve the light propagation loss and to allow an alignment with high accuracy by making the lamination surface of an optical wiring flat and to improve the characteristics of the optical wiring without depending upon the heat quantity of a substrate by improving the thermal insulation characteristic of an adhesive layer. SOLUTION: The optical wiring substrate having at least one optical wiring layer has an adhesive layer between the optical wiring layer and a supporting substrate for supporting the optical wiring layer. The adhesive layer has the thickness above the ruggedness on the surface of the supporting layer and the thermal insulation characteristic. The optical waveguide surface in the optical wiring layer is substantially flat.
申请公布号 JP2002022987(A) 申请公布日期 2002.01.23
申请号 JP20000208528 申请日期 2000.07.10
申请人 TOPPAN PRINTING CO LTD 发明人 KUMAI KOICHI
分类号 G02B6/13;(IPC1-7):G02B6/13 主分类号 G02B6/13
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