发明名称 THICKNESS MEASURING DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent a workpiece from lowering the quality by measuring the thickness of the piece without damage to the piece in various kinds of working devices. SOLUTION: A thickness measuring device 20 is constituted of a laser beam means 21, which irradiates a surface 40a of a workpiece 40 with a laser beam at a prescribed incident angleθ1, an image-pick up means 22, which picks up images of a first reflected beam 30a, which is reflected on the surface 40a of the piece 40, and a second reflected beam 30b, which enters into the piece 40 to reflect on a back surface 40b and then comes from the surface 40a, and a calculating means 23, which calculates a thickness t of the piece 40 from a distance a between the first reflected beam 30a and the second reflected beam 30b, which are picked up by the means 22.
申请公布号 JP2002022417(A) 申请公布日期 2002.01.23
申请号 JP20000212867 申请日期 2000.07.13
申请人 DISCO ABRASIVE SYST LTD 发明人 SEKIYA KAZUMA
分类号 B24B7/22;B24B49/12;G01B11/06;(IPC1-7):G01B11/06 主分类号 B24B7/22
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