| 摘要 |
PROBLEM TO BE SOLVED: To provide a base for IC package having an excellent flame retardancy without using a halogen type flame retardant, high heat resistance and low thermal expansion. SOLUTION: The epoxy resin composition comprises (A) a novolak type epoxy resin, (B) at least one epoxy resin selected from the group consisting of a trishydroxyphenylmethane type epoxy resin and a tetraxishydroxyphenylethane type epoxy resin, (C) a phenolic resin type curing agent having at least three phenolic hydroxyl groups in the molecule, (D) 9,10- dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, and (E) an inorganic filler as essential ingredients.
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