发明名称 METHOD FOR BONDING
摘要 PROBLEM TO BE SOLVED: To provide a method for strongly bonding a piezoelement to a vibrating film and accurately transmitting the vibration. SOLUTION: The piezoelement is bonded to the vibrating film by carrying out steps comprising a step of coating one end of a piezoelement plate with an adhesive and drying the adhesive, a step of processing the piezoelement plate in which the adhesive is dried into a comblike shape so as to leave the piezoelement of a prescribed width according to the interval of nozzles and a step of bonding the one end of the piezoelement processed into the comblike shape having the adhesive to the vibrating film.
申请公布号 JP2002020702(A) 申请公布日期 2002.01.23
申请号 JP20000208168 申请日期 2000.07.10
申请人 CLUSTER TECHNOLOGY CO LTD 发明人 ADACHI MINORU;UESUGI SHOJI
分类号 B41J2/16;B41J2/045;B41J2/055;C09J5/00;(IPC1-7):C09J5/00 主分类号 B41J2/16
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