发明名称 |
METHOD FOR BONDING |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for strongly bonding a piezoelement to a vibrating film and accurately transmitting the vibration. SOLUTION: The piezoelement is bonded to the vibrating film by carrying out steps comprising a step of coating one end of a piezoelement plate with an adhesive and drying the adhesive, a step of processing the piezoelement plate in which the adhesive is dried into a comblike shape so as to leave the piezoelement of a prescribed width according to the interval of nozzles and a step of bonding the one end of the piezoelement processed into the comblike shape having the adhesive to the vibrating film.
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申请公布号 |
JP2002020702(A) |
申请公布日期 |
2002.01.23 |
申请号 |
JP20000208168 |
申请日期 |
2000.07.10 |
申请人 |
CLUSTER TECHNOLOGY CO LTD |
发明人 |
ADACHI MINORU;UESUGI SHOJI |
分类号 |
B41J2/16;B41J2/045;B41J2/055;C09J5/00;(IPC1-7):C09J5/00 |
主分类号 |
B41J2/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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