发明名称 ELECTROLESS GOLD PLATING BATH
摘要 PROBLEM TO BE SOLVED: To provide an electroless gold plating bath by which plating can stably be performed at a relatively low temperature under the approximately neutral pH condition, and a gold plating film excellent in plating appearance can be obtained. SOLUTION: This electroless gold plating bath is obtained by adding cyanide or the complex salt thereof by 0.1 ng/L to 1 g/L as KCN to an electroless gold plating bath containing non-cyanided gold salt, a complexing agent and a reducing agent and has pH of 3.0 to 9.5.
申请公布号 JP2002020874(A) 申请公布日期 2002.01.23
申请号 JP20000203013 申请日期 2000.07.05
申请人 C UYEMURA & CO LTD 发明人 UCHIDA HIROKI;USU RUMIKO
分类号 C23C18/44;(IPC1-7):C23C18/44 主分类号 C23C18/44
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