| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition which, when used as a a resin used in a surface packaging system, is excellent in blister resistance and prevents blisters on the surface of the resin after passing through a reflow oven, and to provide a resin composition which, in addition to the above- mentioned advantages, has high mechanical strengths such as flexural strength, weld strength, and tensile elongation, and is excellent in moldability and slidability. SOLUTION: This resin composition contains a polyamide resin component which comprises (A) 5-95 wt.% polyamide resin prepared by the polycondensation of a diamine component containing tetramethylenediamine with a dicarboxylic acid component containing adipic acid and (B) 95-5 wt.% polyamide resin prepared by the polycondensation of a diamine component containing at least either 1,9-nonanediamine or 2-methyl-1,8-onctanediamine with a dicarboxylic acid component containing terephthalic acid.
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