| 摘要 |
The invention relates to a method of manufacturing an assembly (100) of conductors (1), wherein a void (11) is provided in an electroconductive plate (10), within which void an island (12) is formed which serves as a carrier for a semiconductor element (13) and which is connected to the assembly (100) by a part (14) of the plate (10). Within the void (11), a number of strip-shaped conductors (1) are formed which surround the island (12), and the void (11) is formed so that one (1n) of the strip-shaped conductors (1) is connected to the island (12) by means of a further part (15) of the plate (10). Such a method has the drawback that it is not capable of providing an assembly (100) which can suitably be used for any semiconductor element (13). In particular, said method is expensive for ICs (13) which must demonstrate an electrical connection to the island (12) and which must be supplied in relatively small numbers. In a method in accordance with the invention, the void (11) is formed so that two or more strip-shaped conductors (1) are electroconductively connected to the island (12) by means of a further part (15) of the plate (10), and at least one of the further parts (15) of the plate (10) is removed by means of punching. Such a method is very suitable for ICs whose desired connection to the island (12) may be randomly situated. By removing the redundant connections (15) between the island (12) and the conductors (1) at a late stage in the manufacturing process and at the proper locations, said method in accordance with the invention is flexible, fast and inexpensive. This can be attributed to the fact that only the punching tool (40) used to remove the redundant connections (15) must be adapted to the relevant IC (13). This can be carried out rapidly and in a relatively cheap manner. |
