PROCESS OF FORMING ELECTRICAL CONNECTIONS BETWEEN CONDUCTIVELAYERS USING THERMOSONIC WIRE BONDED BUMP VIAS AND THICK FILM TECHNIQUES

摘要

The process of the present invention allows inter- connecting one conductive layer to another in a Multichip Module. The process uses bumps formed by wire bonding, or any other means of forming bumps of .002"-.004" height with comparable diameter. These bumps create an opening through dielectric insulating layers, thereby allowing one conductive layer to be electrically connected to the next conductive layer.